ITW Devcon® 5 Minute® Fast Cure Epoxy Gel, Application Time: 10 to 15 min., Opaque, Size: 50mL, Cartridge, For Use With: Vertical and Rough Surfaces, Full Cure: 12 hr., Work Life: 7 min., Functional Cure: 45 to 60 min., 1:1 Mixing Ratio, 2500 psi Shear Strength, -40 to 200°F Temperature, Applications: For All Metal Bonding that Requires Fast Curing and Greater Gap Filling Capabilities
- High tensile strength (2500 psi)
- Good solvent resistance to gas, oil and other solvents
- Non sag which makes it ideal for use on vertical surfaces
- Excellent gap filling qualities without tremendous shrinkage
- Fast curing for bond tags on machinery and equipment